Kandou
Last verified 2026-05-05. JSON
The funding figures on this page are attributed, not sourced: a publisher is on record but no document URL is. How we mark provenance.
| Total raised | $225.0Mattributed |
|---|---|
| Latest round | series-a, $225.0M, 2026-03-01attributed |
| Founded | 2011 |
| Headquarters | Lausanne, Switzerland |
| Industry | semiconductors |
| Stage | series-a |
| Website | kandou.com |
Kandou makes Copper MIMO semiconductor interconnect chiplets that wire GPUs, memory, and network gear together inside AI data centers. It serves AI system builders and hyperscalers building chiplet-based AI fabrics. Kandou's copper-MIMO SerDes extends interconnect reach further than standard PAM SerDes, cutting per-rack costs.
Funding rounds
| Date | Round | Amount | Lead |
|---|---|---|---|
| 2026-03-01 | series-a | $225.0M | undisclosed |
Detected tech stack
WordPress, Apache HTTP Server, Metronet Profile Picture 2.6.3, Yoast SEO 25.4, reCAPTCHA, Google Analytics, Google Tag Manager, Stellar.js, jQuery Migrate 3.4.1, DoubleClick Floodlight, Campaign Monitor, cdnjs
Provenance
| Fact | Status | Basis |
|---|---|---|
| Series A, $225.0M | attributed | sifted named as publisher. No document URL on file. |
| Total raised $225.0M | attributed | sifted named as publisher. No document URL on file. |
| Company existence | self-reported | kandou.com, read 2026-05-05 |
| Description | self-reported | kandou.com, read 2026-05-05 |
Nothing on this page is sourced yet. A sourced fact links to a document that states it.
Change history
No change recorded since records began on 2026-09-24.